No-Clean BGA Solder Paste (10cc) (different sets available)
Not Available for Pickup under any circumstances, send direct from independent dropshipping Warehouse
We are a New Zealand business and will get your order to you in 4 - 10 business days worldwide from one of our fulfilment centres located in the USA, China and Australia.
(Inc. GST)
This no-clean solder paste flux is designed to make electronic soldering and repair work smoother and more reliable.
Its strong solder-stickiness and clean performance help improve work efficiency, reduce rework effort, and support precise results in delicate PCB and BGA operations.
Main Features
- Excellent solder-stickiness for stable and secure solder joints
- Excellent anti-wet capacity for controlled soldering
- No-clean and lead-free formula for environmental protection
- Suitable for multiple PCB reflow processes
- Widely used for BGA, PGA, CSP packages, and flip chip operations
- Useful for rework, sphere or pin attachment, and BGA rebelling tasks
Specification
- Flux Type: NC-559-ASM / NC-559-ASM-UV (TPF)
- Volume: 10cc
- Particle Size: 1–10 μm
- Certification: CE
Shipping & Returns
Important Shipping & Return Info for This Item:
Direct Dispatch: Shipped directly to your door from our specialized distributor hubs.
Tracking: Tracked courier details will be emailed as soon as the supplier dispatches your package.
Change of Mind Policy: Because this item cannot be routed back to the supplier warehouse, all sales are final. We do not accept change-of-mind returns, refunds, or exchanges on this product line.
CGA Protected: If the item arrives damaged or faulty, you're covered under the Consumer Guarantees Act. We'll arrange a repair, replacement or refund in line with our Returns Policy.