No-Clean BGA Solder Paste (10cc) (different sets available)

This no-clean solder paste flux is designed to make electronic soldering and repair work smoother and more reliable.

Its strong solder-stickiness and clean performance help improve work efficiency, reduce rework effort, and support precise results in delicate PCB and BGA operations.

Main Features

• Excellent solder-stickiness for stable and secure solder joints
• Excellent anti-wet capacity for controlled soldering
• No-clean and lead-free formula for environmental protection
• Suitable for multiple PCB reflow processes
• Widely used for BGA, PGA, CSP packages, and flip chip operations
• Useful for rework, sphere or pin attachment, and BGA rebelling tasks

Specification

• Flux Type: NC-559-ASM / NC-559-ASM-UV (TPF)
• Volume: 10cc
• Particle Size: 1–10 μm
• Certification: CE